DIE BONDING TOOL AND SYSTEM

Disclosed is a die bonding tool comprising: a rigid body; and a collet having a die-holding portion; wherein the collet is mechanically coupled to the rigid body by a flexible element which is configured to angularly deflect relative to the rigid body on application of a torque to the collet and/or...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHEUNG KWOK YUEN, MENG JIN HUI, TONG KWOK WAH, CHOW MAN KIT, YAU WAN YIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	Disclosed is a die bonding tool comprising: a rigid body; and a collet having a die-holding portion; wherein the collet is mechanically coupled to the rigid body by a flexible element which is configured to angularly deflect relative to the rigid body on application of a torque to the collet and/or to a die held by the collet. Also disclosed is a die bonding system comprising the die bonding tool, and an adhesive dispenser for a die bonding system.