HIGH-POWER ELECTRONIC MODULE AND METHOD FOR MAKING SUCH A MODULE

A power electronic module including at least one pair of power electronic components, each pair including a first and a second component, each component including a first face, configured to be supported on a support and a second face configured to be electrically connected to an electrical circuit...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	WU CONG MARTIN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!