STRUCTURE AND METHOD TO MINIMIZE WARPAGE OF PACKAGED SEMICONDUCTOR DEVICES

A packaged semiconductor device includes a substrate, an electronic device coupled to the substrate, encapsulant including a first major surface surrounding the electronic device, and an oxygen barrier layer within fifty percent of a thickness of the encapsulant from a second major surface of the en...

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Hauptverfasser:	MATHEW VARUGHESE, SINGH AKHILESH K, GUAJARDO JAMES R, LAKHERA NISHANT
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	MATHEW VARUGHESE SINGH AKHILESH K GUAJARDO JAMES R LAKHERA NISHANT
description	A packaged semiconductor device includes a substrate, an electronic device coupled to the substrate, encapsulant including a first major surface surrounding the electronic device, and an oxygen barrier layer within fifty percent of a thickness of the encapsulant from a second major surface of the encapsulant. The oxygen barrier covers at least a portion of an area of the second major surface of the encapsulant to help reduce or eliminate warping of the encapsulant and/or the substrate of the packaged semiconductor device due to oxidation. A thickness of the oxygen barrier layer is less than 100 microns.
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	STRUCTURE AND METHOD TO MINIMIZE WARPAGE OF PACKAGED SEMICONDUCTOR DEVICES
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