METHOD FOR DEPOSITING THICK COPPER LAYERS ONTO SINTERED MATERIALS
The present invention relates to a method for electrodepositing a thick copper layer onto an electrically conductive, sintered layer. The thick copper layer has a high adhesion strength, is poor in defects and internal stress, and has high electrical and thermal conductivity. The thick copper layer...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | DAMBROWSKY NINA MCNELLY ANTHONY RUETHER ROBERT GENTH HERKO GLOEDEN MARKUS |
| description | The present invention relates to a method for electrodepositing a thick copper layer onto an electrically conductive, sintered layer. The thick copper layer has a high adhesion strength, is poor in defects and internal stress, and has high electrical and thermal conductivity. The thick copper layer on the sintered layer is suited for printed circuit boards for high power electronic applications. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2016060781A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2016060781A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2016060781A13</originalsourceid><addsrcrecordid>eNrjZHD0dQ3x8HdRcPMPUnBxDfAP9gzx9HNXCPHwdPZWcPYPCHANUvBxjHQNClbw9wvxVwj29AtxDXJ1UfB1BNKejj7BPAysaYk5xam8UJqbQdnNNcTZQze1ID8-tbggMTk1L7UkPjTYyMDQzMDMwNzC0NHQmDhVAJJvLAQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR DEPOSITING THICK COPPER LAYERS ONTO SINTERED MATERIALS</title><source>esp@cenet</source><creator>DAMBROWSKY NINA ; MCNELLY ANTHONY ; RUETHER ROBERT ; GENTH HERKO ; GLOEDEN MARKUS</creator><creatorcontrib>DAMBROWSKY NINA ; MCNELLY ANTHONY ; RUETHER ROBERT ; GENTH HERKO ; GLOEDEN MARKUS</creatorcontrib><description>The present invention relates to a method for electrodepositing a thick copper layer onto an electrically conductive, sintered layer. The thick copper layer has a high adhesion strength, is poor in defects and internal stress, and has high electrical and thermal conductivity. The thick copper layer on the sintered layer is suited for printed circuit boards for high power electronic applications.</description><language>eng</language><subject>APPARATUS THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160303&DB=EPODOC&CC=US&NR=2016060781A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160303&DB=EPODOC&CC=US&NR=2016060781A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DAMBROWSKY NINA</creatorcontrib><creatorcontrib>MCNELLY ANTHONY</creatorcontrib><creatorcontrib>RUETHER ROBERT</creatorcontrib><creatorcontrib>GENTH HERKO</creatorcontrib><creatorcontrib>GLOEDEN MARKUS</creatorcontrib><title>METHOD FOR DEPOSITING THICK COPPER LAYERS ONTO SINTERED MATERIALS</title><description>The present invention relates to a method for electrodepositing a thick copper layer onto an electrically conductive, sintered layer. The thick copper layer has a high adhesion strength, is poor in defects and internal stress, and has high electrical and thermal conductivity. The thick copper layer on the sintered layer is suited for printed circuit boards for high power electronic applications.</description><subject>APPARATUS THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD0dQ3x8HdRcPMPUnBxDfAP9gzx9HNXCPHwdPZWcPYPCHANUvBxjHQNClbw9wvxVwj29AtxDXJ1UfB1BNKejj7BPAysaYk5xam8UJqbQdnNNcTZQze1ID8-tbggMTk1L7UkPjTYyMDQzMDMwNzC0NHQmDhVAJJvLAQ</recordid><startdate>20160303</startdate><enddate>20160303</enddate><creator>DAMBROWSKY NINA</creator><creator>MCNELLY ANTHONY</creator><creator>RUETHER ROBERT</creator><creator>GENTH HERKO</creator><creator>GLOEDEN MARKUS</creator><scope>EVB</scope></search><sort><creationdate>20160303</creationdate><title>METHOD FOR DEPOSITING THICK COPPER LAYERS ONTO SINTERED MATERIALS</title><author>DAMBROWSKY NINA ; MCNELLY ANTHONY ; RUETHER ROBERT ; GENTH HERKO ; GLOEDEN MARKUS</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2016060781A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>APPARATUS THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>DAMBROWSKY NINA</creatorcontrib><creatorcontrib>MCNELLY ANTHONY</creatorcontrib><creatorcontrib>RUETHER ROBERT</creatorcontrib><creatorcontrib>GENTH HERKO</creatorcontrib><creatorcontrib>GLOEDEN MARKUS</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DAMBROWSKY NINA</au><au>MCNELLY ANTHONY</au><au>RUETHER ROBERT</au><au>GENTH HERKO</au><au>GLOEDEN MARKUS</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR DEPOSITING THICK COPPER LAYERS ONTO SINTERED MATERIALS</title><date>2016-03-03</date><risdate>2016</risdate><abstract>The present invention relates to a method for electrodepositing a thick copper layer onto an electrically conductive, sintered layer. The thick copper layer has a high adhesion strength, is poor in defects and internal stress, and has high electrical and thermal conductivity. The thick copper layer on the sintered layer is suited for printed circuit boards for high power electronic applications.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2016060781A1 |
| source | esp@cenet |
| subjects | APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | METHOD FOR DEPOSITING THICK COPPER LAYERS ONTO SINTERED MATERIALS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-28T20%3A12%3A11IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=DAMBROWSKY%20NINA&rft.date=2016-03-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2016060781A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |