SUBSTRATE FOR ORGANIC ELECTRONIC DEVICE

SUBSTRATE FOR ORGANIC ELECTRONIC DEVICE

Provided are a substrate for an organic electronic device (OED) and a use thereof. The substrate may have excellent interfacial cohesive property by preventing interlayer delamination between the organic material layer and the inorganic material layer when being applied to manufacture a flexible dev...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: JEONG HYE WON, LEE SANG JUN, SHIN BO RA, PARK HANG AH, LEE JUNG HYOUNG, IM MI RA, KIM JI HEE
Format: Patent
Sprache:eng
Schlagworte:
ELECTRICITY
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator JEONG HYE WON
LEE SANG JUN
SHIN BO RA
PARK HANG AH
LEE JUNG HYOUNG
IM MI RA
KIM JI HEE
description Provided are a substrate for an organic electronic device (OED) and a use thereof. The substrate may have excellent interfacial cohesive property by preventing interlayer delamination between the organic material layer and the inorganic material layer when being applied to manufacture a flexible device including a structure in which an organic material layer and an inorganic material layer are present together. In addition, when the substrate for an OED is used, an OED may have excellent durability and an excellent another required physical property such as light extraction efficiency.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2016056411A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2016056411A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2016056411A13</originalsourceid><addsrcrecordid>eNrjZFAPDnUKDglyDHFVcPMPUvAPcnf083RWcPVxdQ4J8gcxXVzDPJ1deRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfGiwkYGhmYGpmYmhoaOhMXGqAHckJLU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SUBSTRATE FOR ORGANIC ELECTRONIC DEVICE</title><source>esp@cenet</source><creator>JEONG HYE WON ; LEE SANG JUN ; SHIN BO RA ; PARK HANG AH ; LEE JUNG HYOUNG ; IM MI RA ; KIM JI HEE</creator><creatorcontrib>JEONG HYE WON ; LEE SANG JUN ; SHIN BO RA ; PARK HANG AH ; LEE JUNG HYOUNG ; IM MI RA ; KIM JI HEE</creatorcontrib><description>Provided are a substrate for an organic electronic device (OED) and a use thereof. The substrate may have excellent interfacial cohesive property by preventing interlayer delamination between the organic material layer and the inorganic material layer when being applied to manufacture a flexible device including a structure in which an organic material layer and an inorganic material layer are present together. In addition, when the substrate for an OED is used, an OED may have excellent durability and an excellent another required physical property such as light extraction efficiency.</description><language>eng</language><subject>ELECTRICITY</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160225&amp;DB=EPODOC&amp;CC=US&amp;NR=2016056411A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160225&amp;DB=EPODOC&amp;CC=US&amp;NR=2016056411A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JEONG HYE WON</creatorcontrib><creatorcontrib>LEE SANG JUN</creatorcontrib><creatorcontrib>SHIN BO RA</creatorcontrib><creatorcontrib>PARK HANG AH</creatorcontrib><creatorcontrib>LEE JUNG HYOUNG</creatorcontrib><creatorcontrib>IM MI RA</creatorcontrib><creatorcontrib>KIM JI HEE</creatorcontrib><title>SUBSTRATE FOR ORGANIC ELECTRONIC DEVICE</title><description>Provided are a substrate for an organic electronic device (OED) and a use thereof. The substrate may have excellent interfacial cohesive property by preventing interlayer delamination between the organic material layer and the inorganic material layer when being applied to manufacture a flexible device including a structure in which an organic material layer and an inorganic material layer are present together. In addition, when the substrate for an OED is used, an OED may have excellent durability and an excellent another required physical property such as light extraction efficiency.</description><subject>ELECTRICITY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAPDnUKDglyDHFVcPMPUvAPcnf083RWcPVxdQ4J8gcxXVzDPJ1deRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfGiwkYGhmYGpmYmhoaOhMXGqAHckJLU</recordid><startdate>20160225</startdate><enddate>20160225</enddate><creator>JEONG HYE WON</creator><creator>LEE SANG JUN</creator><creator>SHIN BO RA</creator><creator>PARK HANG AH</creator><creator>LEE JUNG HYOUNG</creator><creator>IM MI RA</creator><creator>KIM JI HEE</creator><scope>EVB</scope></search><sort><creationdate>20160225</creationdate><title>SUBSTRATE FOR ORGANIC ELECTRONIC DEVICE</title><author>JEONG HYE WON ; LEE SANG JUN ; SHIN BO RA ; PARK HANG AH ; LEE JUNG HYOUNG ; IM MI RA ; KIM JI HEE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2016056411A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>ELECTRICITY</topic><toplevel>online_resources</toplevel><creatorcontrib>JEONG HYE WON</creatorcontrib><creatorcontrib>LEE SANG JUN</creatorcontrib><creatorcontrib>SHIN BO RA</creatorcontrib><creatorcontrib>PARK HANG AH</creatorcontrib><creatorcontrib>LEE JUNG HYOUNG</creatorcontrib><creatorcontrib>IM MI RA</creatorcontrib><creatorcontrib>KIM JI HEE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JEONG HYE WON</au><au>LEE SANG JUN</au><au>SHIN BO RA</au><au>PARK HANG AH</au><au>LEE JUNG HYOUNG</au><au>IM MI RA</au><au>KIM JI HEE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE FOR ORGANIC ELECTRONIC DEVICE</title><date>2016-02-25</date><risdate>2016</risdate><abstract>Provided are a substrate for an organic electronic device (OED) and a use thereof. The substrate may have excellent interfacial cohesive property by preventing interlayer delamination between the organic material layer and the inorganic material layer when being applied to manufacture a flexible device including a structure in which an organic material layer and an inorganic material layer are present together. In addition, when the substrate for an OED is used, an OED may have excellent durability and an excellent another required physical property such as light extraction efficiency.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2016056411A1
source esp@cenet
subjects ELECTRICITY
title SUBSTRATE FOR ORGANIC ELECTRONIC DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-09T14%3A00%3A03IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JEONG%20HYE%20WON&rft.date=2016-02-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2016056411A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true