DIGITAL RADIATION SENSOR PACKAGE

DIGITAL RADIATION SENSOR PACKAGE

A radiation sensing apparatus includes, in a vertically stacked configuration: a radiation sensor chip, an integrated circuit chip beneath the radiation sensor chip, and an optical element above the radiation sensor chip. The radiation sensor chip has a radiation sensing element and an electrically-...

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Hauptverfasser: PANDY ANAND, BARLOW ARTHUR JOHN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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BARLOW ARTHUR JOHN
description A radiation sensing apparatus includes, in a vertically stacked configuration: a radiation sensor chip, an integrated circuit chip beneath the radiation sensor chip, and an optical element above the radiation sensor chip. The radiation sensor chip has a radiation sensing element and an electrically-conductive contact coupled to the radiation sensing element and exposed at a lower surface. The integrated circuit chip has an integrated circuit and an electrical conductor coupled to the integrated circuit and exposed at an upper surface. The electrically conductive contact at the lower surface of the radiation sensor chip is physically and electrically coupled to the electrical conductor at the upper surface of the integrated circuit chip. The optical element is configured to pass incident radiation at a wavelength that the radiation sensing element is configured to sense.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2016049434A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2016049434A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2016049434A13</originalsourceid><addsrcrecordid>eNrjZFBw8XT3DHH0UQhydPF0DPH091MIdvUL9g9SCHB09nZ0d-VhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhmYGJpYmxiaOhsbEqQIAcjcivA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DIGITAL RADIATION SENSOR PACKAGE</title><source>esp@cenet</source><creator>PANDY ANAND ; BARLOW ARTHUR JOHN</creator><creatorcontrib>PANDY ANAND ; BARLOW ARTHUR JOHN</creatorcontrib><description>A radiation sensing apparatus includes, in a vertically stacked configuration: a radiation sensor chip, an integrated circuit chip beneath the radiation sensor chip, and an optical element above the radiation sensor chip. The radiation sensor chip has a radiation sensing element and an electrically-conductive contact coupled to the radiation sensing element and exposed at a lower surface. The integrated circuit chip has an integrated circuit and an electrical conductor coupled to the integrated circuit and exposed at an upper surface. The electrically conductive contact at the lower surface of the radiation sensor chip is physically and electrically coupled to the electrical conductor at the upper surface of the integrated circuit chip. The optical element is configured to pass incident radiation at a wavelength that the radiation sensing element is configured to sense.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160218&amp;DB=EPODOC&amp;CC=US&amp;NR=2016049434A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160218&amp;DB=EPODOC&amp;CC=US&amp;NR=2016049434A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PANDY ANAND</creatorcontrib><creatorcontrib>BARLOW ARTHUR JOHN</creatorcontrib><title>DIGITAL RADIATION SENSOR PACKAGE</title><description>A radiation sensing apparatus includes, in a vertically stacked configuration: a radiation sensor chip, an integrated circuit chip beneath the radiation sensor chip, and an optical element above the radiation sensor chip. The radiation sensor chip has a radiation sensing element and an electrically-conductive contact coupled to the radiation sensing element and exposed at a lower surface. The integrated circuit chip has an integrated circuit and an electrical conductor coupled to the integrated circuit and exposed at an upper surface. The electrically conductive contact at the lower surface of the radiation sensor chip is physically and electrically coupled to the electrical conductor at the upper surface of the integrated circuit chip. The optical element is configured to pass incident radiation at a wavelength that the radiation sensing element is configured to sense.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFBw8XT3DHH0UQhydPF0DPH091MIdvUL9g9SCHB09nZ0d-VhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhmYGJpYmxiaOhsbEqQIAcjcivA</recordid><startdate>20160218</startdate><enddate>20160218</enddate><creator>PANDY ANAND</creator><creator>BARLOW ARTHUR JOHN</creator><scope>EVB</scope></search><sort><creationdate>20160218</creationdate><title>DIGITAL RADIATION SENSOR PACKAGE</title><author>PANDY ANAND ; BARLOW ARTHUR JOHN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2016049434A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>PANDY ANAND</creatorcontrib><creatorcontrib>BARLOW ARTHUR JOHN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PANDY ANAND</au><au>BARLOW ARTHUR JOHN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DIGITAL RADIATION SENSOR PACKAGE</title><date>2016-02-18</date><risdate>2016</risdate><abstract>A radiation sensing apparatus includes, in a vertically stacked configuration: a radiation sensor chip, an integrated circuit chip beneath the radiation sensor chip, and an optical element above the radiation sensor chip. The radiation sensor chip has a radiation sensing element and an electrically-conductive contact coupled to the radiation sensing element and exposed at a lower surface. The integrated circuit chip has an integrated circuit and an electrical conductor coupled to the integrated circuit and exposed at an upper surface. The electrically conductive contact at the lower surface of the radiation sensor chip is physically and electrically coupled to the electrical conductor at the upper surface of the integrated circuit chip. The optical element is configured to pass incident radiation at a wavelength that the radiation sensing element is configured to sense.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title DIGITAL RADIATION SENSOR PACKAGE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-20T09%3A38%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=PANDY%20ANAND&rft.date=2016-02-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2016049434A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true