TRANSFER UNIT
A transfer unit transferring a wafer from or to a cassette is provided. The transfer unit includes a holding portion holding the wafer under suction and a driving portion moving the holding portion. The holding portion includes a body, a plurality of suction openings formed on the upper surface of t...
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| creator | MANTOKU KIMITAKE OKADA SHIGEFUMI URABE HIROYUKI ONISHI KENTA WATANABE YUKI |
| description | A transfer unit transferring a wafer from or to a cassette is provided. The transfer unit includes a holding portion holding the wafer under suction and a driving portion moving the holding portion. The holding portion includes a body, a plurality of suction openings formed on the upper surface of the body so as to be spaced from each other, a vacuum transmitting passage connected to a vacuum source for transmitting a vacuum from the vacuum source to the suction openings, and a plurality of suction pads provided at the suction openings, each suction pad being formed of an elastic material. The suction openings are spaced from each other in the radial direction of the wafer, and the suction pads are selectively provided at any desired ones of the suction openings. |
| format | Patent |
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The transfer unit includes a holding portion holding the wafer under suction and a driving portion moving the holding portion. The holding portion includes a body, a plurality of suction openings formed on the upper surface of the body so as to be spaced from each other, a vacuum transmitting passage connected to a vacuum source for transmitting a vacuum from the vacuum source to the suction openings, and a plurality of suction pads provided at the suction openings, each suction pad being formed of an elastic material. The suction openings are spaced from each other in the radial direction of the wafer, and the suction pads are selectively provided at any desired ones of the suction openings.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHAMBERS PROVIDED WITH MANIPULATION DEVICES ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; HAND TOOLS ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; MANIPULATORS ; PERFORMING OPERATIONS ; POLISHING ; PORTABLE POWER-DRIVEN TOOLS ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160218&DB=EPODOC&CC=US&NR=2016049326A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160218&DB=EPODOC&CC=US&NR=2016049326A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MANTOKU KIMITAKE</creatorcontrib><creatorcontrib>OKADA SHIGEFUMI</creatorcontrib><creatorcontrib>URABE HIROYUKI</creatorcontrib><creatorcontrib>ONISHI KENTA</creatorcontrib><creatorcontrib>WATANABE YUKI</creatorcontrib><title>TRANSFER UNIT</title><description>A transfer unit transferring a wafer from or to a cassette is provided. 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The transfer unit includes a holding portion holding the wafer under suction and a driving portion moving the holding portion. The holding portion includes a body, a plurality of suction openings formed on the upper surface of the body so as to be spaced from each other, a vacuum transmitting passage connected to a vacuum source for transmitting a vacuum from the vacuum source to the suction openings, and a plurality of suction pads provided at the suction openings, each suction pad being formed of an elastic material. The suction openings are spaced from each other in the radial direction of the wafer, and the suction pads are selectively provided at any desired ones of the suction openings.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
| recordid | cdi_epo_espacenet_US2016049326A1 |
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| subjects | BASIC ELECTRIC ELEMENTS CHAMBERS PROVIDED WITH MANIPULATION DEVICES DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING HAND TOOLS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MANIPULATORS PERFORMING OPERATIONS POLISHING PORTABLE POWER-DRIVEN TOOLS SEMICONDUCTOR DEVICES TRANSPORTING |
| title | TRANSFER UNIT |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-26T19%3A02%3A02IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MANTOKU%20KIMITAKE&rft.date=2016-02-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2016049326A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |