METHOD FOR SEPARATING AND TRANSFERRING IC CHIPS

A method for separating a multiple number of semiconductor devices or semiconductor integrated circuits from a wafer on which the multiple number of semiconductor devices or semiconductor integrated circuits are formed is provided. The method includes separating each of the semiconductor devices or...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAMADA MASAHIRO, IWASAKI KENYA, NISHIKAWA HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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