ELECTRODEPOSITION OF SILVER WITH FLUOROPOLYMER NANOPARTICLES
Electrolytic plating compositions and electrolytic plating processes for the co-deposition of silver or silver alloy with fluoropolymer nanoparticles are provided. The silver or silver alloy composite coating containing fluoropolymer nanoparticles has enhanced functional properties such as a reduced...
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creator | KUDRAK, JR. EDWARD J LI JINGYE ABYS JOSEPH A |
description | Electrolytic plating compositions and electrolytic plating processes for the co-deposition of silver or silver alloy with fluoropolymer nanoparticles are provided. The silver or silver alloy composite coating containing fluoropolymer nanoparticles has enhanced functional properties such as a reduced coefficient of friction. The electrolytic plating composition comprises: (a) a silver ion source comprising silver methane sulfonate (Ag-MSA); (b) a complexing agent comprising a compound comprising a nitrogen-containing heterocyclic ring; (c) a pre-mix dispersion comprising fluoropolymer nanoparticles particles having a mean particle size of from about 10 nm and about 500 nm and a surfactant; and (d) an auxiliary surfactant comprising a cationic fluorosurfactant, wherein the composition has a pH of from about 8 to about 14. |
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EDWARD J ; LI JINGYE ; ABYS JOSEPH A</creatorcontrib><description>Electrolytic plating compositions and electrolytic plating processes for the co-deposition of silver or silver alloy with fluoropolymer nanoparticles are provided. The silver or silver alloy composite coating containing fluoropolymer nanoparticles has enhanced functional properties such as a reduced coefficient of friction. The electrolytic plating composition comprises: (a) a silver ion source comprising silver methane sulfonate (Ag-MSA); (b) a complexing agent comprising a compound comprising a nitrogen-containing heterocyclic ring; (c) a pre-mix dispersion comprising fluoropolymer nanoparticles particles having a mean particle size of from about 10 nm and about 500 nm and a surfactant; and (d) an auxiliary surfactant comprising a cationic fluorosurfactant, wherein the composition has a pH of from about 8 to about 14.</description><language>eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160204&DB=EPODOC&CC=US&NR=2016032479A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160204&DB=EPODOC&CC=US&NR=2016032479A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUDRAK, JR. 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The electrolytic plating composition comprises: (a) a silver ion source comprising silver methane sulfonate (Ag-MSA); (b) a complexing agent comprising a compound comprising a nitrogen-containing heterocyclic ring; (c) a pre-mix dispersion comprising fluoropolymer nanoparticles particles having a mean particle size of from about 10 nm and about 500 nm and a surfactant; and (d) an auxiliary surfactant comprising a cationic fluorosurfactant, wherein the composition has a pH of from about 8 to about 14.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBx9XF1Dgnyd3EN8A_2DPH091Pwd1MI9vQJcw1SCPcM8VBw8wn1D_IP8PeJ9AUK-Tn6-Qc4BoV4Ovu4BvMwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvjQYCMDQzMDYyMTc0tHQ2PiVAEABFsrPw</recordid><startdate>20160204</startdate><enddate>20160204</enddate><creator>KUDRAK, JR. 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The electrolytic plating composition comprises: (a) a silver ion source comprising silver methane sulfonate (Ag-MSA); (b) a complexing agent comprising a compound comprising a nitrogen-containing heterocyclic ring; (c) a pre-mix dispersion comprising fluoropolymer nanoparticles particles having a mean particle size of from about 10 nm and about 500 nm and a surfactant; and (d) an auxiliary surfactant comprising a cationic fluorosurfactant, wherein the composition has a pH of from about 8 to about 14.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
title | ELECTRODEPOSITION OF SILVER WITH FLUOROPOLYMER NANOPARTICLES |
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