SPUTTERING APPARATUS

A sputtering apparatus that forms a film on a substrate by sputtering in a chamber includes an electrode including a holding portion that holds a target, and configured to apply a potential to the target via the holding portion, a first magnet and second magnet arranged to sandwich a space between t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHIBAMOTO MASAHIRO, KARINO SUSUMU
Format: Patent
Sprache:eng
Schlagworte:
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