CHIP COIL COMPONENT

There is provided a chip coil component including: a ceramic body in which a plurality of ceramic layers are disposed and of which a bottom surface is provided as a mounting surface; a first external electrode disposed on one end surface of the ceramic body in a length direction of the ceramic body...

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1. Verfasser: LIM BONG SUP
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creator LIM BONG SUP
description There is provided a chip coil component including: a ceramic body in which a plurality of ceramic layers are disposed and of which a bottom surface is provided as a mounting surface; a first external electrode disposed on one end surface of the ceramic body in a length direction of the ceramic body and a top surface and the bottom surface of the ceramic body; and a second external electrode disposed on the other end surface of the ceramic body in the length direction of the ceramic body and the bottom surface of the ceramic body.
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a first external electrode disposed on one end surface of the ceramic body in a length direction of the ceramic body and a top surface and the bottom surface of the ceramic body; and a second external electrode disposed on the other end surface of the ceramic body in the length direction of the ceramic body and the bottom surface of the ceramic body.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRICITY</subject><subject>INDUCTANCES</subject><subject>MAGNETS</subject><subject>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</subject><subject>TRANSFORMERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB29vAMUHD29_QBEr4B_n6ufiE8DKxpiTnFqbxQmptB2c01xNlDN7UgPz61uCAxOTUvtSQ-NNjIwNDMwNDI0tTc0dCYOFUAyc8fLg</recordid><startdate>20160114</startdate><enddate>20160114</enddate><creator>LIM BONG SUP</creator><scope>EVB</scope></search><sort><creationdate>20160114</creationdate><title>CHIP COIL COMPONENT</title><author>LIM BONG SUP</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2016012957A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRICITY</topic><topic>INDUCTANCES</topic><topic>MAGNETS</topic><topic>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</topic><topic>TRANSFORMERS</topic><toplevel>online_resources</toplevel><creatorcontrib>LIM BONG SUP</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIM BONG SUP</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CHIP COIL COMPONENT</title><date>2016-01-14</date><risdate>2016</risdate><abstract>There is provided a chip coil component including: a ceramic body in which a plurality of ceramic layers are disposed and of which a bottom surface is provided as a mounting surface; a first external electrode disposed on one end surface of the ceramic body in a length direction of the ceramic body and a top surface and the bottom surface of the ceramic body; and a second external electrode disposed on the other end surface of the ceramic body in the length direction of the ceramic body and the bottom surface of the ceramic body.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
title CHIP COIL COMPONENT
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