DESIGN OF A HEAT DISSIPATION STRUCTURE FOR AN INTEGRATED CIRCUIT (IC) CHIP

An apparatus for cooling an integrated circuit (IC) die is described. The apparatus includes an adhesion layer coated on a surface of the IC die, wherein the adhesion layer has high thermal conductivity. The apparatus also includes a heat dissipation structure affixed onto the adhesion layer. This h...

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Hauptverfasser:	ANKIREDDI SESHASAYEE S, COPELAND DAVID W
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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