Integrated Circuit Arrangement
An integrated circuit arrangement comprising: a flange, the flange comprising conducting material; a transistor die disposed on the surface of the flange; a first conducting element, the first conducting element being electrically connected to the transistor die to allow current flow from the transi...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | An integrated circuit arrangement comprising: a flange, the flange comprising conducting material; a transistor die disposed on the surface of the flange; a first conducting element, the first conducting element being electrically connected to the transistor die to allow current flow from the transistor die; wherein the flange comprises one or more reduced thickness portions, the one or more reduced thickness portions being configured to control current flow passing through the flange to the transistor die. |
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