BONDING ALIGNMENT TOOL

An apparatus includes a bonding system configured to bond at least two wafers. The bonding system has a flag-out mechanism configured to remove a plurality of flags from an area between the at least two wafers. The apparatus also includes sensors configured to detect data related to a flag-out condi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG I-SHI, LIN JENG-HAO, SHIH YUN-TAI, SU CHING-HOU, NI CHYI-TSONG, PAN KUAN-MING, TSAI WUN-KAI, CHO JUI-MU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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