PROCESS FOR ELECTROLESS PLATING AND A SOLUTION USED FOR THE SAME
A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating...
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| creator | YEE DENNIS KWOK-WAI CHAN HUNG-TAT YIP KA-MING TANG MICHAEL CHI-YUNG BAYES MARTIN W LI TSUI-KIU CHAN CHUN-MAN LIU LOK-LOK |
| description | A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2015322574A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2015322574A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2015322574A13</originalsourceid><addsrcrecordid>eNrjZHAICPJ3dg0OVnDzD1Jw9XF1Dgny9wHxA3wcQzz93BUc_VwUHBWC_X1CQzz9_RRCg11dwGpDPFwVgh19XXkYWNMSc4pTeaE0N4Oym2uIs4duakF-fGpxQWJyal5qSXxosJGBoamxkZGpuYmjoTFxqgBGoCtj</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PROCESS FOR ELECTROLESS PLATING AND A SOLUTION USED FOR THE SAME</title><source>esp@cenet</source><creator>YEE DENNIS KWOK-WAI ; CHAN HUNG-TAT ; YIP KA-MING ; TANG MICHAEL CHI-YUNG ; BAYES MARTIN W ; LI TSUI-KIU ; CHAN CHUN-MAN ; LIU LOK-LOK</creator><creatorcontrib>YEE DENNIS KWOK-WAI ; CHAN HUNG-TAT ; YIP KA-MING ; TANG MICHAEL CHI-YUNG ; BAYES MARTIN W ; LI TSUI-KIU ; CHAN CHUN-MAN ; LIU LOK-LOK</creatorcontrib><description>A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating.</description><language>eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151112&DB=EPODOC&CC=US&NR=2015322574A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151112&DB=EPODOC&CC=US&NR=2015322574A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YEE DENNIS KWOK-WAI</creatorcontrib><creatorcontrib>CHAN HUNG-TAT</creatorcontrib><creatorcontrib>YIP KA-MING</creatorcontrib><creatorcontrib>TANG MICHAEL CHI-YUNG</creatorcontrib><creatorcontrib>BAYES MARTIN W</creatorcontrib><creatorcontrib>LI TSUI-KIU</creatorcontrib><creatorcontrib>CHAN CHUN-MAN</creatorcontrib><creatorcontrib>LIU LOK-LOK</creatorcontrib><title>PROCESS FOR ELECTROLESS PLATING AND A SOLUTION USED FOR THE SAME</title><description>A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAICPJ3dg0OVnDzD1Jw9XF1Dgny9wHxA3wcQzz93BUc_VwUHBWC_X1CQzz9_RRCg11dwGpDPFwVgh19XXkYWNMSc4pTeaE0N4Oym2uIs4duakF-fGpxQWJyal5qSXxosJGBoamxkZGpuYmjoTFxqgBGoCtj</recordid><startdate>20151112</startdate><enddate>20151112</enddate><creator>YEE DENNIS KWOK-WAI</creator><creator>CHAN HUNG-TAT</creator><creator>YIP KA-MING</creator><creator>TANG MICHAEL CHI-YUNG</creator><creator>BAYES MARTIN W</creator><creator>LI TSUI-KIU</creator><creator>CHAN CHUN-MAN</creator><creator>LIU LOK-LOK</creator><scope>EVB</scope></search><sort><creationdate>20151112</creationdate><title>PROCESS FOR ELECTROLESS PLATING AND A SOLUTION USED FOR THE SAME</title><author>YEE DENNIS KWOK-WAI ; CHAN HUNG-TAT ; YIP KA-MING ; TANG MICHAEL CHI-YUNG ; BAYES MARTIN W ; LI TSUI-KIU ; CHAN CHUN-MAN ; LIU LOK-LOK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2015322574A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>YEE DENNIS KWOK-WAI</creatorcontrib><creatorcontrib>CHAN HUNG-TAT</creatorcontrib><creatorcontrib>YIP KA-MING</creatorcontrib><creatorcontrib>TANG MICHAEL CHI-YUNG</creatorcontrib><creatorcontrib>BAYES MARTIN W</creatorcontrib><creatorcontrib>LI TSUI-KIU</creatorcontrib><creatorcontrib>CHAN CHUN-MAN</creatorcontrib><creatorcontrib>LIU LOK-LOK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YEE DENNIS KWOK-WAI</au><au>CHAN HUNG-TAT</au><au>YIP KA-MING</au><au>TANG MICHAEL CHI-YUNG</au><au>BAYES MARTIN W</au><au>LI TSUI-KIU</au><au>CHAN CHUN-MAN</au><au>LIU LOK-LOK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PROCESS FOR ELECTROLESS PLATING AND A SOLUTION USED FOR THE SAME</title><date>2015-11-12</date><risdate>2015</risdate><abstract>A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | PROCESS FOR ELECTROLESS PLATING AND A SOLUTION USED FOR THE SAME |
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