WIRING SUBSTRATE AND PRODUCTION METHOD THEREFOR

A wiring substrate includes an insulation substrate, a through hole, an upper-surface-side land conductor, a lower-surface-side land conductor, and a through hole conductor. The insulation substrate includes a first insulation layer, a second insulation layer, and a glass fiber layer provided betwee...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MAEDA SHINNOSUKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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