ULTRASONIC PROBE AND MANUFACTURING METHOD THEREOF

An ultrasonic probe includes a capacitive micromachined ultrasonic transducer (cMUT) array configured to generate ultrasonic waves, an integrated circuit to which the cMUT array is bonded, and a flexible printed circuit board having one end connected to the integrated circuit to output signals to th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM YOUNGIL, ROH YONGRAE, SONG JONG KEUN, CHO KYUNGIL, LEE EUNSUNG, KIM BAEHYUNG, CHOI MINSEOG
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:An ultrasonic probe includes a capacitive micromachined ultrasonic transducer (cMUT) array configured to generate ultrasonic waves, an integrated circuit to which the cMUT array is bonded, and a flexible printed circuit board having one end connected to the integrated circuit to output signals to the integrated circuit, the integrated circuit including pads provided on the integrated circuit and an anisotropic conductive film (ACF) provided on the pads, and the one end of the flexible printed circuit board being connected to the ACF to thereby connect the flexible printed circuit board to the integrated circuit.