COATED SUBSTRATE AND PROCESS FOR CUTTING A COATED SUBSTRATE

A system and method of forming a sapphire component. The method may include disposing an absorptive-barrier layer on a first surface of a sapphire substrate, performing a cut in the sapphire substrate using a laser beam incident on the absorptive-barrier layer, and forming and removing molten sapphi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUN YULEI, MOLINA RAUL A, RICHTER ANTHONY J, LI MICHAEL M
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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