THERMAL INTERFACE MATERIAL HANDLING FOR THERMAL CONTROL OF AN ELECTRONIC COMPONENT UNDER TEST

Thermal interface material handing is described for thermal control of an electronic component under test. In one example, a thermal control unit is adapted to control the temperature of at least a portion of an electronic component during testing. A pedestal between the thermal control unit and the...

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Bibliographische Detailangaben

Hauptverfasser:	CHIGULLAPALLI SRUTI, SCHROEDER CHRISTOPHER ROY, KRESS LOTHAR, DIGLIO PAUL JONATHAN, SONG DAVID WON-JUN, WALCZYK JOSEPH, YOUNG TODD MICHAEL, KRISHNAMOORTHY ARUN, FULTON CHARLES CLIFTON, BENNETT ROBERT LEVI
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING
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