THREE DIMENSIONAL INTEGRATED CIRCUIT AND METHOD FOR CONTROLLING THE SAME

A three dimensional integrated circuit includes a master circuit, a slave circuit, and a through-silicon via (TSV). The master circuit is configured to receive and process an input data, a data strobe signal (DQS) and an input command to output a writing data signal to a master die. The through-sili...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TAKAHASHI TSUGIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PULSE TECHNIQUE SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!