Semiconductor Workpiece Having a Semiconductor Substrate with at Least Two Chip Areas

Semiconductor Workpiece Having a Semiconductor Substrate with at Least Two Chip Areas

A semiconductor workpiece includes a semiconductor substrate, at least two chip areas, components of semiconductor devices being formed in the semiconductor substrate in the at least two chip areas, and a separation trench disposed between adjacent chip areas. The separation trench is formed in a fi...

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Hauptverfasser: ZUNDEL MARKUS, MEISER ANDREAS, EHRENTRAUT GEORG, POELZL MARTIN, GANITZER PAUL
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator ZUNDEL MARKUS
MEISER ANDREAS
EHRENTRAUT GEORG
POELZL MARTIN
GANITZER PAUL
description A semiconductor workpiece includes a semiconductor substrate, at least two chip areas, components of semiconductor devices being formed in the semiconductor substrate in the at least two chip areas, and a separation trench disposed between adjacent chip areas. The separation trench is formed in a first main surface of the semiconductor substrate and extends from the first main surface to a second main surface of the semiconductor substrate. The second main surface is disposed opposite to the first main surface. The separation trench is filled with at least one sacrificial material.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor Workpiece Having a Semiconductor Substrate with at Least Two Chip Areas
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