HOT MELT ADHESIVE COMPOSITIONS THAT INCLUDE PROPYLENE POLYMER AND ETHYLENE COPOLYMER

Disclosed is a hot melt adhesive composition that includes a polymer component that includes a propylene polymer that includes greater than 50 mole % propylene and exhibiting a melt index greater than 150 grams per ten minutes at 190° C., and an ethylene copolymer exhibiting a melt index of at least...

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Bibliographische Detailangaben

Hauptverfasser:	LARSON KIM, EICHLER-JOHNSON BETH M, BURGE KEVIN P, MANSOUR AMEARA S, JONES CHERYL A
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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