SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

A method of manufacturing a semiconductor device is disclosed. In the method, a substrate having a first surface and a second surface is provided. The second surface is opposed to the first surface. A via hole is formed to penetrate the substrate from the first surface toward the second surface. The...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PARK SEUNG-HOON, KOO DEOG-JA, MIN GYUNG-JIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!