TRANSFER MOLDING METHOD, DIE STRUCTURE, TRANSFER MOLDING DEVICE, AND OPTICAL MEMBER

A die structure has a first die, a second die that comes in contact with and separate from the first die, a heating unit provided in at least one of the first and second dies, and a transfer member provided in at least one of the first and second dies that brings a resin sheet supplied between the f...

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Bibliographische Detailangaben
Hauptverfasser: TAKEMURA KOICHI, TAGUCHI TOSHIKAGA, KOJIMA MASAYUKI, KITAMURA NORIKAZU, SHINOHARA MASAYUKI, TAKAHASHI YUKIHIRO, MAKUTA ISAO, YAMANAKA YOSHIHISA, SHIBATA TOMOFUSA, HIROTA KAZUHIDE
Format: Patent
Sprache:eng
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