METHOD OF CONTACTING SUBSTRATE WITH PROBE CARD

A method of contacting a substrate with a probe card in a substrate inspection apparatus can inspect electrical characteristics of semiconductor devices on the substrate. A wafer W is transferred to a position facing a probe card 36 while being mounted on a chuck member 22 with a wafer plate 37 ther...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAMADA HIROSHI, HYAKUDOMI TAKANORI, MOCHIZUKI JUN, FURUYA KUNIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING
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