METHOD OF CONTACTING SUBSTRATE WITH PROBE CARD

METHOD OF CONTACTING SUBSTRATE WITH PROBE CARD

A method of contacting a substrate with a probe card in a substrate inspection apparatus can inspect electrical characteristics of semiconductor devices on the substrate. A wafer W is transferred to a position facing a probe card 36 while being mounted on a chuck member 22 with a wafer plate 37 ther...

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Hauptverfasser: YAMADA HIROSHI, HYAKUDOMI TAKANORI, MOCHIZUKI JUN, FURUYA KUNIHIRO
Format: Patent
Sprache:eng
Schlagworte:
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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creator YAMADA HIROSHI
HYAKUDOMI TAKANORI
MOCHIZUKI JUN
FURUYA KUNIHIRO
description A method of contacting a substrate with a probe card in a substrate inspection apparatus can inspect electrical characteristics of semiconductor devices on the substrate. A wafer W is transferred to a position facing a probe card 36 while being mounted on a chuck member 22 with a wafer plate 37 therebetween, and electrodes of semiconductor devices on the wafer W are contacted with probes of the probe card 36 by moving the wafer W and the wafer plate 37 toward the probe card 36 through an elevating device 43. Then, the wafer W is overdriven toward the probe card 36 and a contact state between the electrodes of the semiconductor devices and the probes of the probe card 36 is maintained by decompressing a space S between the probe card 36 and the wafer plate 37. Then, the chuck member 22 is separated from the wafer plate 37.
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subjects MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
title METHOD OF CONTACTING SUBSTRATE WITH PROBE CARD
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