HEAT SINK AND SEMICONDUCTOR DEVICE

HEAT SINK AND SEMICONDUCTOR DEVICE

A heat sink includes a frame having an opening, the opening extending in a thickness direction of the frame, the opening having a first opening part and a second opening part, the second opening part being larger than the first opening part in a plan view perpendicular to the thickness direction, a...

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Hauptverfasser: NEGORO SHUJI, TAKEUCHI KESAYUKI, YONEMOCHI MASAHIRO, SEKI MASAFUMI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator NEGORO SHUJI
TAKEUCHI KESAYUKI
YONEMOCHI MASAHIRO
SEKI MASAFUMI
description A heat sink includes a frame having an opening, the opening extending in a thickness direction of the frame, the opening having a first opening part and a second opening part, the second opening part being larger than the first opening part in a plan view perpendicular to the thickness direction, a wall standing on the frame at an edge of the opening, a groove formed in the frame beside the wall, and a plate member including a first plate disposed in the first opening part and a second plate disposed in the second opening part and larger than the first plate in the plan view, wherein the second opening part is larger than the second plate in the plan view to leave a gap therebetween, and the wall is bent toward the opening to be in contact with an edge along a perimeter of the second plate.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title HEAT SINK AND SEMICONDUCTOR DEVICE
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