SYSTEM AND METHOD FOR LASER CUTTING SAPPHIRE USING MULTIPLE GAS MEDIA

A system and a method for manufacturing a sapphire part. A sapphire substrate is obtained for performing a laser cutting operation. The sapphire substrate is cut along a cut profile using a laser and a first gas medium. The first gas medium is substantially comprised of an inert gas. The sapphire su...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: RICHTER ANTHONY J, LI MICHAEL M, MEMERING DALE N
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator RICHTER ANTHONY J
LI MICHAEL M
MEMERING DALE N
description A system and a method for manufacturing a sapphire part. A sapphire substrate is obtained for performing a laser cutting operation. The sapphire substrate is cut along a cut profile using a laser and a first gas medium. The first gas medium is substantially comprised of an inert gas. The sapphire substrate is then irradiated at or near the cut profile using the laser and a second gas medium. The second gas medium is different than the first gas medium comprising oxygen.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2015209903A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2015209903A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2015209903A13</originalsourceid><addsrcrecordid>eNrjZHANjgwOcfVVcPRzUfB1DfHwd1Fw8w9S8HEMdg1ScA4NCfH0c1cIdgwI8PAMclUIDQZxfUN9QjwDfFwV3B2DgZpcPB15GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakl8aLCRgaGpkYGlpYGxo6ExcaoAKk4s3A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SYSTEM AND METHOD FOR LASER CUTTING SAPPHIRE USING MULTIPLE GAS MEDIA</title><source>esp@cenet</source><creator>RICHTER ANTHONY J ; LI MICHAEL M ; MEMERING DALE N</creator><creatorcontrib>RICHTER ANTHONY J ; LI MICHAEL M ; MEMERING DALE N</creatorcontrib><description>A system and a method for manufacturing a sapphire part. A sapphire substrate is obtained for performing a laser cutting operation. The sapphire substrate is cut along a cut profile using a laser and a first gas medium. The first gas medium is substantially comprised of an inert gas. The sapphire substrate is then irradiated at or near the cut profile using the laser and a second gas medium. The second gas medium is different than the first gas medium comprising oxygen.</description><language>eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20150730&amp;DB=EPODOC&amp;CC=US&amp;NR=2015209903A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20150730&amp;DB=EPODOC&amp;CC=US&amp;NR=2015209903A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RICHTER ANTHONY J</creatorcontrib><creatorcontrib>LI MICHAEL M</creatorcontrib><creatorcontrib>MEMERING DALE N</creatorcontrib><title>SYSTEM AND METHOD FOR LASER CUTTING SAPPHIRE USING MULTIPLE GAS MEDIA</title><description>A system and a method for manufacturing a sapphire part. A sapphire substrate is obtained for performing a laser cutting operation. The sapphire substrate is cut along a cut profile using a laser and a first gas medium. The first gas medium is substantially comprised of an inert gas. The sapphire substrate is then irradiated at or near the cut profile using the laser and a second gas medium. The second gas medium is different than the first gas medium comprising oxygen.</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHANjgwOcfVVcPRzUfB1DfHwd1Fw8w9S8HEMdg1ScA4NCfH0c1cIdgwI8PAMclUIDQZxfUN9QjwDfFwV3B2DgZpcPB15GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakl8aLCRgaGpkYGlpYGxo6ExcaoAKk4s3A</recordid><startdate>20150730</startdate><enddate>20150730</enddate><creator>RICHTER ANTHONY J</creator><creator>LI MICHAEL M</creator><creator>MEMERING DALE N</creator><scope>EVB</scope></search><sort><creationdate>20150730</creationdate><title>SYSTEM AND METHOD FOR LASER CUTTING SAPPHIRE USING MULTIPLE GAS MEDIA</title><author>RICHTER ANTHONY J ; LI MICHAEL M ; MEMERING DALE N</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2015209903A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>RICHTER ANTHONY J</creatorcontrib><creatorcontrib>LI MICHAEL M</creatorcontrib><creatorcontrib>MEMERING DALE N</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RICHTER ANTHONY J</au><au>LI MICHAEL M</au><au>MEMERING DALE N</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SYSTEM AND METHOD FOR LASER CUTTING SAPPHIRE USING MULTIPLE GAS MEDIA</title><date>2015-07-30</date><risdate>2015</risdate><abstract>A system and a method for manufacturing a sapphire part. A sapphire substrate is obtained for performing a laser cutting operation. The sapphire substrate is cut along a cut profile using a laser and a first gas medium. The first gas medium is substantially comprised of an inert gas. The sapphire substrate is then irradiated at or near the cut profile using the laser and a second gas medium. The second gas medium is different than the first gas medium comprising oxygen.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2015209903A1
source esp@cenet
subjects CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title SYSTEM AND METHOD FOR LASER CUTTING SAPPHIRE USING MULTIPLE GAS MEDIA
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-06T07%3A16%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=RICHTER%20ANTHONY%20J&rft.date=2015-07-30&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2015209903A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true