ROUGHENED SUBSTRATE SUPPORT

ROUGHENED SUBSTRATE SUPPORT

The present disclosure generally relates to a substrate support for use in a substrate processing chamber. A roughened substrate support reduces arcing within the chamber and also contributes to uniform deposition on the substrate. A substrate support may have a substrate support body having a surfa...

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Hauptverfasser: LEE DONGSUH, STERLING WILLIAM N, PARK BEOM SOO, CHOI SOO YOUNG
Format: Patent
Sprache:eng
Schlagworte:
ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
GRINDING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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creator LEE DONGSUH
STERLING WILLIAM N
PARK BEOM SOO
CHOI SOO YOUNG
description The present disclosure generally relates to a substrate support for use in a substrate processing chamber. A roughened substrate support reduces arcing within the chamber and also contributes to uniform deposition on the substrate. A substrate support may have a substrate support body having a surface roughness of between about 707 micro-inches and about 834 micro-inches. The substrate support may have an anodized coating on the substrate support.
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subjects ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
GRINDING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
title ROUGHENED SUBSTRATE SUPPORT
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