PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

A package substrate and a method for manufacturing the same are disclosed. The method for manufacturing a package substrate in accordance with an aspect of the present invention includes: forming a first open hole corresponding to a shape of a bonding pad in a first photo resist; laminating a second...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HWANG JUN-OH, KOOK SEUNG-YEOP, KANG MYUNG-SAM, LEE YOUNG-KWAN, LEE SEUNG-EUN, IM SE-RANG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!