SYSTEM AND METHOD FOR MANUFACTURING A FABRICATED CARRIER

A method of fabricating a BGA carrier, the method comprising combining a conductive portion and a molded dielectric portion, the dielectric portion having a top surface, a bottom surface and an inner surface, the inner surface intersecting said top surface and said bottom surface, the inner surface...

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1. Verfasser: CHEUNG KA WA
Format: Patent
Sprache:eng
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