SOLID-STATE LINEAR LIGHTING ARRANGEMENTS INCLUDING LIGHT EMITTING PHOSPHOR

SOLID-STATE LINEAR LIGHTING ARRANGEMENTS INCLUDING LIGHT EMITTING PHOSPHOR

A method is described for manufacturing an LED lamp module, where the individual LEDs in the lamp module do not include a conventional package structure and/or integrated encapsulation on the individual LEDs. The lamp module includes a co-extruded component, the co-extruded component comprising an e...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LEE HYUNGUL, LI YI-QUN, YANG HAITAO, EDWARDS CHARLES
Format: Patent
Sprache:eng
Schlagworte:
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
BLASTING
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF
HEATING
LIGHTING
MECHANICAL ENGINEERING
PERFORMING OPERATIONS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR
TRANSPORTING
WEAPONS
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:A method is described for manufacturing an LED lamp module, where the individual LEDs in the lamp module do not include a conventional package structure and/or integrated encapsulation on the individual LEDs. The lamp module includes a co-extruded component, the co-extruded component comprising an elongate lens and a layer of photoluminescent material. The elongate lens is for shaping light emitted from the lamp and comprises an elongate interior cavity. The layer of a photoluminescent material is located on an interior wall of the elongate interior cavity. An optical medium is provided as part of the manufacturing process for the lamp module, where the optical medium surrounds the LEDs in an array of LEDs. The optical medium can be co-extruded over the LEDs. In addition, a liquid optical medium can be applied in the assembly process to remove air interfaces between the LEDs and component.