SAMPLE ENCAPSULATION SYSTEM AND METHOD
A sample encapsulation system includes a base, a chamber having an inlet and a chamber housing in which the chamber is housed. The chamber is fixedly mounted at least in part within the housing and the housing is movably mounted to the base. The system includes a cap, a first ram operably mounted to...
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| creator | GOSIS ANATOLY SCHMIDT DANIEL P SHEWEY CHARLES E SHKOLNIKOV YURY ADAIR KURT G CECKOWSKI DOUGLAS A FRESON LAWRENCE L O'FLAHERTY SEAN HART MICHAEL F |
| description | A sample encapsulation system includes a base, a chamber having an inlet and a chamber housing in which the chamber is housed. The chamber is fixedly mounted at least in part within the housing and the housing is movably mounted to the base. The system includes a cap, a first ram operably mounted to the cap for engaging the chamber inlet and a second ram positioned in the chamber opposite the inlet. The second ram is movable toward and away from the first ram. The chamber and housing are movable toward the cap for engaging the first ram with the chamber inlet during an encapsulation cycle and away from the cap, disengaging the first ram from the chamber inlet following an encapsulation cycle. The system includes heating and cooling assemblies and a temperature sensor located remotely from the chamber interior to automatically isolate cooling water to the system. |
| format | Patent |
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The chamber is fixedly mounted at least in part within the housing and the housing is movably mounted to the base. The system includes a cap, a first ram operably mounted to the cap for engaging the chamber inlet and a second ram positioned in the chamber opposite the inlet. The second ram is movable toward and away from the first ram. The chamber and housing are movable toward the cap for engaging the first ram with the chamber inlet during an encapsulation cycle and away from the cap, disengaging the first ram from the chamber inlet following an encapsulation cycle. The system includes heating and cooling assemblies and a temperature sensor located remotely from the chamber interior to automatically isolate cooling water to the system.</description><language>eng</language><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; MEASURING QUANTITY OF HEAT ; MEASURING TEMPERATURE ; PHYSICS ; TESTING ; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150528&DB=EPODOC&CC=US&NR=2015143928A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150528&DB=EPODOC&CC=US&NR=2015143928A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GOSIS ANATOLY</creatorcontrib><creatorcontrib>SCHMIDT DANIEL P</creatorcontrib><creatorcontrib>SHEWEY CHARLES E</creatorcontrib><creatorcontrib>SHKOLNIKOV YURY</creatorcontrib><creatorcontrib>ADAIR KURT G</creatorcontrib><creatorcontrib>CECKOWSKI DOUGLAS A</creatorcontrib><creatorcontrib>FRESON LAWRENCE L</creatorcontrib><creatorcontrib>O'FLAHERTY SEAN</creatorcontrib><creatorcontrib>HART MICHAEL F</creatorcontrib><title>SAMPLE ENCAPSULATION SYSTEM AND METHOD</title><description>A sample encapsulation system includes a base, a chamber having an inlet and a chamber housing in which the chamber is housed. 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The chamber is fixedly mounted at least in part within the housing and the housing is movably mounted to the base. The system includes a cap, a first ram operably mounted to the cap for engaging the chamber inlet and a second ram positioned in the chamber opposite the inlet. The second ram is movable toward and away from the first ram. The chamber and housing are movable toward the cap for engaging the first ram with the chamber inlet during an encapsulation cycle and away from the cap, disengaging the first ram from the chamber inlet following an encapsulation cycle. The system includes heating and cooling assemblies and a temperature sensor located remotely from the chamber interior to automatically isolate cooling water to the system.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING QUANTITY OF HEAT MEASURING TEMPERATURE PHYSICS TESTING THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR |
| title | SAMPLE ENCAPSULATION SYSTEM AND METHOD |
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