PATTERNED PHOTORESIST TO ATTACH A CARRIER WAFER TO A SILICON DEVICE WAFER

PATTERNED PHOTORESIST TO ATTACH A CARRIER WAFER TO A SILICON DEVICE WAFER

Patterned photoresist is used to attach a carrier wafer to a silicon device wafer. In one example, a silicon wafer is patterned for contact bumps by applying a photoresist over a surface of the wafer and removing the photoresist in locations at which the contact bumps are to be formed. The contact b...

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Hauptverfasser: TOH CHIN HOCK, KITOWSKI AKSEL, TAN THEAN MING, MAHAJAN UDAY
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator TOH CHIN HOCK
KITOWSKI AKSEL
TAN THEAN MING
MAHAJAN UDAY
description Patterned photoresist is used to attach a carrier wafer to a silicon device wafer. In one example, a silicon wafer is patterned for contact bumps by applying a photoresist over a surface of the wafer and removing the photoresist in locations at which the contact bumps are to be formed. The contact bumps are formed in the locations at which the photoresist is removed. A temporary carrier is attached to the photoresist over the wafer. The back side of the wafer opposite the contact bumps is processed while handling the wafer using the temporary carrier. The temporary carrier is removed. The photoresist on the front side of the wafer with the contact bumps is removed after removing the temporary carrier.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title PATTERNED PHOTORESIST TO ATTACH A CARRIER WAFER TO A SILICON DEVICE WAFER
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