HYBRID METALLIZATION ON PLASTIC FOR A LIGHT EMITTING DIODE (LED) LIGHTING SYSTEM
Provided is a multi-layer reflective coating for application to a lighting housing assembly, including a polymer substrate adjacent a polymer base coat layer applied to the lighting housing. Atop the polymer base coat layer is an aluminum adhesion layer, followed by a diffusive barrier layer, and a...
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| creator | SMITH GABRIEL MICHAEL CAI DENGKE MAYER MARK J SAHA KOUSHIK ZHAO TIANJI LOU XIAOMEI BROWN PETER W |
| description | Provided is a multi-layer reflective coating for application to a lighting housing assembly, including a polymer substrate adjacent a polymer base coat layer applied to the lighting housing. Atop the polymer base coat layer is an aluminum adhesion layer, followed by a diffusive barrier layer, and a silver reflective layer. The aluminum adhesion layer promotes adhesion between the polymer base coat layer and the silver reflective layer. The diffusive barrier layer prevents aluminum and silver interaction, which could form a silver and aluminum alloy. A spectrum tunable layer is applied atop the silver reflective layer for spectrum tuning the silver reflective layer for maximum compatibility with a light emitting diode (LED) lighting source. |
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A spectrum tunable layer is applied atop the silver reflective layer for spectrum tuning the silver reflective layer for maximum compatibility with a light emitting diode (LED) lighting source.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAjwiHQK8nRR8HUNcfTx8YxyDPH091MAogAfx-AQT2cFN_8gBUcFH093jxAFV1_PkBBPP3cFF09_F1cFDR9XF02IFEgwODI4xNWXh4E1LTGnOJUXSnMzKLu5hjh76KYW5MenFhckJqfmpZbEhwYbGRiaGhpbmFsYORoaE6cKAAamL6g</recordid><startdate>20150521</startdate><enddate>20150521</enddate><creator>SMITH GABRIEL MICHAEL</creator><creator>CAI DENGKE</creator><creator>MAYER MARK J</creator><creator>SAHA KOUSHIK</creator><creator>ZHAO TIANJI</creator><creator>LOU XIAOMEI</creator><creator>BROWN PETER W</creator><scope>EVB</scope></search><sort><creationdate>20150521</creationdate><title>HYBRID METALLIZATION ON PLASTIC FOR A LIGHT EMITTING DIODE (LED) LIGHTING SYSTEM</title><author>SMITH GABRIEL MICHAEL ; CAI DENGKE ; MAYER MARK J ; SAHA KOUSHIK ; ZHAO TIANJI ; LOU XIAOMEI ; BROWN PETER W</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2015138782A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>SMITH GABRIEL MICHAEL</creatorcontrib><creatorcontrib>CAI DENGKE</creatorcontrib><creatorcontrib>MAYER MARK J</creatorcontrib><creatorcontrib>SAHA KOUSHIK</creatorcontrib><creatorcontrib>ZHAO TIANJI</creatorcontrib><creatorcontrib>LOU XIAOMEI</creatorcontrib><creatorcontrib>BROWN PETER W</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SMITH GABRIEL MICHAEL</au><au>CAI DENGKE</au><au>MAYER MARK J</au><au>SAHA KOUSHIK</au><au>ZHAO TIANJI</au><au>LOU XIAOMEI</au><au>BROWN PETER W</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HYBRID METALLIZATION ON PLASTIC FOR A LIGHT EMITTING DIODE (LED) LIGHTING SYSTEM</title><date>2015-05-21</date><risdate>2015</risdate><abstract>Provided is a multi-layer reflective coating for application to a lighting housing assembly, including a polymer substrate adjacent a polymer base coat layer applied to the lighting housing. Atop the polymer base coat layer is an aluminum adhesion layer, followed by a diffusive barrier layer, and a silver reflective layer. The aluminum adhesion layer promotes adhesion between the polymer base coat layer and the silver reflective layer. The diffusive barrier layer prevents aluminum and silver interaction, which could form a silver and aluminum alloy. A spectrum tunable layer is applied atop the silver reflective layer for spectrum tuning the silver reflective layer for maximum compatibility with a light emitting diode (LED) lighting source.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING LIGHTING MECHANICAL ENGINEERING OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS |
| title | HYBRID METALLIZATION ON PLASTIC FOR A LIGHT EMITTING DIODE (LED) LIGHTING SYSTEM |
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