INTERCONNECT FOR TRANSMITTING SIGNALS BETWEEN A DEVICE AND A TESTER

A system includes: a circuit board including electrical elements arranged at a first pitch; a wafer including contacts arranged at a second pitch, where the second pitch is less than the first pitch; and an interconnect including additively-manufactured electrical conduits that are part of an electr...

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Bibliographische Detailangaben
Hauptverfasser:	SINSHEIMER ROGER ALLEN, LEWINNEK DAVID WALTER, VALIENTE LUIS ANTONIO, DIPALO CRAIG ANTHONY
Format:	Patent
Sprache:	eng
Schlagworte:	GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TESTING
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Beschreibung
Zusammenfassung:	A system includes: a circuit board including electrical elements arranged at a first pitch; a wafer including contacts arranged at a second pitch, where the second pitch is less than the first pitch; and an interconnect including additively-manufactured electrical conduits that are part of an electrical pathway between the electrical elements and the contacts, where the additively-manufactured electrical conduits include electrically-conductive material.