SEMICONDUCTOR PACKAGE WITH GEL FILLED CAVITY

A semiconductor device package is assembled using a jig that alters the shape of gel material disposed in a cavity in the package. In one embodiment, a jig having a concave bottom surface is inserted onto uncured gel material disposed within a cavity in a housing of the package to change a top surfa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DORAISAMY STANLEY JOB, CHEE SOO CHOONG, CHAN SOON KANG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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