SEMICONDUCTOR PACKAGE WITH GEL FILLED CAVITY
A semiconductor device package is assembled using a jig that alters the shape of gel material disposed in a cavity in the package. In one embodiment, a jig having a concave bottom surface is inserted onto uncured gel material disposed within a cavity in a housing of the package to change a top surfa...
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creator | DORAISAMY STANLEY JOB CHEE SOO CHOONG CHAN SOON KANG |
description | A semiconductor device package is assembled using a jig that alters the shape of gel material disposed in a cavity in the package. In one embodiment, a jig having a concave bottom surface is inserted onto uncured gel material disposed within a cavity in a housing of the package to change a top surface of the gel from having a concave shape to a convex shape. The gel is then cured with the jig in place. When the jig is subsequently removed, the cured gel retains the convex shape, which helps to avoid any bond wires from being exposed. The re-shaped gel material reduces internal stresses during thermal cycling and can therefore reduce permanent damage to the package otherwise resulting from such thermal cycling. |
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In one embodiment, a jig having a concave bottom surface is inserted onto uncured gel material disposed within a cavity in a housing of the package to change a top surface of the gel from having a concave shape to a convex shape. The gel is then cured with the jig in place. When the jig is subsequently removed, the cured gel retains the convex shape, which helps to avoid any bond wires from being exposed. The re-shaped gel material reduces internal stresses during thermal cycling and can therefore reduce permanent damage to the package otherwise resulting from such thermal cycling.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150521&DB=EPODOC&CC=US&NR=2015137278A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,782,887,25571,76555</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150521&DB=EPODOC&CC=US&NR=2015137278A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DORAISAMY STANLEY JOB</creatorcontrib><creatorcontrib>CHEE SOO CHOONG</creatorcontrib><creatorcontrib>CHAN SOON KANG</creatorcontrib><title>SEMICONDUCTOR PACKAGE WITH GEL FILLED CAVITY</title><description>A semiconductor device package is assembled using a jig that alters the shape of gel material disposed in a cavity in the package. 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The re-shaped gel material reduces internal stresses during thermal cycling and can therefore reduce permanent damage to the package otherwise resulting from such thermal cycling.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAJdvX1dPb3cwl1DvEPUghwdPZ2dHdVCPcM8VBwd_VRcPP08XF1UXB2DPMMieRhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhqaGxuZG5haOhsbEqQIAJpomDg</recordid><startdate>20150521</startdate><enddate>20150521</enddate><creator>DORAISAMY STANLEY JOB</creator><creator>CHEE SOO CHOONG</creator><creator>CHAN SOON KANG</creator><scope>EVB</scope></search><sort><creationdate>20150521</creationdate><title>SEMICONDUCTOR PACKAGE WITH GEL FILLED CAVITY</title><author>DORAISAMY STANLEY JOB ; CHEE SOO CHOONG ; CHAN SOON KANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2015137278A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>DORAISAMY STANLEY JOB</creatorcontrib><creatorcontrib>CHEE SOO CHOONG</creatorcontrib><creatorcontrib>CHAN SOON KANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DORAISAMY STANLEY JOB</au><au>CHEE SOO CHOONG</au><au>CHAN SOON KANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR PACKAGE WITH GEL FILLED CAVITY</title><date>2015-05-21</date><risdate>2015</risdate><abstract>A semiconductor device package is assembled using a jig that alters the shape of gel material disposed in a cavity in the package. In one embodiment, a jig having a concave bottom surface is inserted onto uncured gel material disposed within a cavity in a housing of the package to change a top surface of the gel from having a concave shape to a convex shape. The gel is then cured with the jig in place. When the jig is subsequently removed, the cured gel retains the convex shape, which helps to avoid any bond wires from being exposed. The re-shaped gel material reduces internal stresses during thermal cycling and can therefore reduce permanent damage to the package otherwise resulting from such thermal cycling.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | SEMICONDUCTOR PACKAGE WITH GEL FILLED CAVITY |
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