TWO-STEP METHOD FOR JOINING A SEMICONDUCTOR TO A SUBSTRATE WITH CONNECTING MATERIAL BASED ON SILVER

The invention relates to a method for joining a semiconductor (20) to a substrate (10), comprising the following steps: *applying a first paste layer (1) of a sintering paste to the substrate; *heating and compressing the first paste layer to form a first sintered layer; *applying a second paste lay...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FRUEH CHRISTIANE, GUENTHER MICHAEL, HERBOTH THOMAS
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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