AQUEOUS CLEAN SOLUTION WITH LOW COPPER ETCH RATE FOR ORGANIC RESIDUE REMOVAL IMPROVEMENT

A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include at least one quaternary base, at least one amine, at least one corrosion inh...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JENQ SHRANE NING, LIU JUN, THOMAS NICOLE, BOGGS KARL E
Format:	Patent
Sprache:	eng
Schlagworte:	ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES APPARATUS THEREFOR CANDLES CHEMISTRY DETERGENT COMPOSITIONS DETERGENTS ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FATTY ACIDS THEREFROM METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS RECOVERY OF GLYCEROL RESIN SOAPS SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS
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