APPARATUS, DEVICE AND METHOD FOR WAFER DICING

An apparatus, device and method for wafer dicing is disclosed. In one example, the apparatus discloses: a wafer holding device having a first temperature; a die separation bar moveably coupled to the wafer holding device; and a cooling device coupled to the apparatus and having a second temperature...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BUENNING HARTMUT, ALBERMANN GUIDO, BACKER HEIKO, LAPKE MARTIN, ROHLEDER THOMAS, MOELLER SASCHA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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