Electronic Device Having Housing With Embedded Interconnects
An electronic device has an electronic device housing containing electrical components such as integrated circuits and other components. The electronic device housing may be provided with signal paths. Electrical components may be mounted to the electronic device housing and may be electrically coup...
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| creator | CHANG RAY L |
| description | An electronic device has an electronic device housing containing electrical components such as integrated circuits and other components. The electronic device housing may be provided with signal paths. Electrical components may be mounted to the electronic device housing and may be electrically coupled to the signal paths. The housing may be provided with channels in which signal lines are routed. The housing may be formed from a material such as metal. A layer of dielectric in the channel may be interposed between the metal of the housing and the signal lines in the channel. Capacitive coupling and inductive coupling may be used to electrically couple the electrical components to a signal line in the channel. Solder may be used to solder contacts on the electrical components to a signal line in the channel. Meandering channels and channels that traverse right-angled surfaces may be used. |
| format | Patent |
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The electronic device housing may be provided with signal paths. Electrical components may be mounted to the electronic device housing and may be electrically coupled to the signal paths. The housing may be provided with channels in which signal lines are routed. The housing may be formed from a material such as metal. A layer of dielectric in the channel may be interposed between the metal of the housing and the signal lines in the channel. Capacitive coupling and inductive coupling may be used to electrically couple the electrical components to a signal line in the channel. Solder may be used to solder contacts on the electrical components to a signal line in the channel. Meandering channels and channels that traverse right-angled surfaces may be used.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150402&DB=EPODOC&CC=US&NR=2015092382A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150402&DB=EPODOC&CC=US&NR=2015092382A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHANG RAY L</creatorcontrib><title>Electronic Device Having Housing With Embedded Interconnects</title><description>An electronic device has an electronic device housing containing electrical components such as integrated circuits and other components. 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The electronic device housing may be provided with signal paths. Electrical components may be mounted to the electronic device housing and may be electrically coupled to the signal paths. The housing may be provided with channels in which signal lines are routed. The housing may be formed from a material such as metal. A layer of dielectric in the channel may be interposed between the metal of the housing and the signal lines in the channel. Capacitive coupling and inductive coupling may be used to electrically couple the electrical components to a signal line in the channel. Solder may be used to solder contacts on the electrical components to a signal line in the channel. Meandering channels and channels that traverse right-angled surfaces may be used.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Electronic Device Having Housing With Embedded Interconnects |
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