POLYCRYSTALLINE DIAMOND CUTTING ELEMENT

A polycrystalline-diamond cutting element for a drill bit of a downhole tool. The cutting element includes a substrate and a diamond table bonded to the substrate. The diamond table includes a diamond filler with at least one leached polycrystalline diamond segment packed therein along at least one...

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Hauptverfasser: SUE JIINJEN ALBERT, ZHAN GUODONG, SETLUR DEEPTHI RAJ, HUGHES MICHAEL D, SRESHTA HAROLD A, FRANCIS MARK JONATHAN, GILLEYLEN RUSSELL C
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creator SUE JIINJEN ALBERT
ZHAN GUODONG
SETLUR DEEPTHI RAJ
HUGHES MICHAEL D
SRESHTA HAROLD A
FRANCIS MARK JONATHAN
GILLEYLEN RUSSELL C
description A polycrystalline-diamond cutting element for a drill bit of a downhole tool. The cutting element includes a substrate and a diamond table bonded to the substrate. The diamond table includes a diamond filler with at least one leached polycrystalline diamond segment packed therein along at least one working surface thereof. The cutting element may be formed by positioning the diamond table on the substrate and bonding the diamond table onto the substrate such that the polycrystalline diamond segment is positioned along at least one working surface of the diamond table. A spark plasma sintering or double press operation may be used to bond the diamond table onto the substrate.
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The cutting element includes a substrate and a diamond table bonded to the substrate. The diamond table includes a diamond filler with at least one leached polycrystalline diamond segment packed therein along at least one working surface thereof. The cutting element may be formed by positioning the diamond table on the substrate and bonding the diamond table onto the substrate such that the polycrystalline diamond segment is positioned along at least one working surface of the diamond table. 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The cutting element includes a substrate and a diamond table bonded to the substrate. The diamond table includes a diamond filler with at least one leached polycrystalline diamond segment packed therein along at least one working surface thereof. The cutting element may be formed by positioning the diamond table on the substrate and bonding the diamond table onto the substrate such that the polycrystalline diamond segment is positioned along at least one working surface of the diamond table. A spark plasma sintering or double press operation may be used to bond the diamond table onto the substrate.</abstract><oa>free_for_read</oa></addata></record>
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subjects EARTH DRILLING
EARTH DRILLING, e.g. DEEP DRILLING
FIXED CONSTRUCTIONS
GRINDING
MINING
OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR ASLURRY OF MINERALS FROM WELLS
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
title POLYCRYSTALLINE DIAMOND CUTTING ELEMENT
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