SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

Disclosed is a semiconductor device in which, when two adjacent semiconductor chips are coupled with bonding wires, a short circuit between the adjacent bonding wires can be suppressed. A first bonding wire, a second bonding wire, a third bonding wire, and a fourth bonding wire are lined up in this...

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Hauptverfasser: ISHINO TAKAHIRO, ASAMURA NORIHIRO
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator ISHINO TAKAHIRO
ASAMURA NORIHIRO
description Disclosed is a semiconductor device in which, when two adjacent semiconductor chips are coupled with bonding wires, a short circuit between the adjacent bonding wires can be suppressed. A first bonding wire, a second bonding wire, a third bonding wire, and a fourth bonding wire are lined up in this order along a first side. When viewed from a direction perpendicular to a chip mounting part, a maximum of the space between the first bonding wire and the second bonding wire is larger than that of the space between the second bonding wire and the third bonding wire. Further, a maximum of the space between the second bonding wire and the third bonding wire is larger than that of the space between the third bonding wire and the fourth bonding wire.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
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