CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE

A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first...

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Hauptverfasser: NAKAMURA HIROSHI, KAI TAKEHIKO, SHIMAMURA MASAYA, MUGIYA EIJI, SAJI TETSUO
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creator NAKAMURA HIROSHI
KAI TAKEHIKO
SHIMAMURA MASAYA
MUGIYA EIJI
SAJI TETSUO
description A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE
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