VOLTAGE CONTRAST INSPECTION OF DEEP TRENCH ISOLATION
A method including forming a first test structure and a second test structure in electrical contact with an inner buried plate and an outer buried plate, respectively, where the first and second test structures each comprise a deep trench filled with a conductive material, and measuring the voltage...
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creator | ARNOLD NORBERT LIU JIN PATTERSON OLIVER D MESSENGER BRIAN W |
description | A method including forming a first test structure and a second test structure in electrical contact with an inner buried plate and an outer buried plate, respectively, where the first and second test structures each comprise a deep trench filled with a conductive material, and measuring the voltage of the inner buried plate and the outer buried plate immediately after the formation of a deep trench isolation structure, where the inner buried plate and the outer buried plate are positioned on opposite sides of the deep trench isolation structure. |
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ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150212&DB=EPODOC&CC=US&NR=2015041809A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150212&DB=EPODOC&CC=US&NR=2015041809A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ARNOLD NORBERT</creatorcontrib><creatorcontrib>LIU JIN</creatorcontrib><creatorcontrib>PATTERSON OLIVER D</creatorcontrib><creatorcontrib>MESSENGER BRIAN W</creatorcontrib><title>VOLTAGE CONTRAST INSPECTION OF DEEP TRENCH ISOLATION</title><description>A method including forming a first test structure and a second test structure in electrical contact with an inner buried plate and an outer buried plate, respectively, where the first and second test structures each comprise a deep trench filled with a conductive material, and measuring the voltage of the inner buried plate and the outer buried plate immediately after the formation of a deep trench isolation structure, where the inner buried plate and the outer buried plate are positioned on opposite sides of the deep trench isolation structure.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAJ8_cJcXR3VXD29wsJcgwOUfD0Cw5wdQ7x9PdT8HdTcHF1DVAICXL1c_ZQ8Az293EESfAwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvjQYCMDQ1MDE0MLA0tHQ2PiVAEAdoYocA</recordid><startdate>20150212</startdate><enddate>20150212</enddate><creator>ARNOLD NORBERT</creator><creator>LIU JIN</creator><creator>PATTERSON OLIVER D</creator><creator>MESSENGER BRIAN W</creator><scope>EVB</scope></search><sort><creationdate>20150212</creationdate><title>VOLTAGE CONTRAST INSPECTION OF DEEP TRENCH ISOLATION</title><author>ARNOLD NORBERT ; 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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | VOLTAGE CONTRAST INSPECTION OF DEEP TRENCH ISOLATION |
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