Apparatus and Method for Forming Alignment Features for Back Side Processing of a Wafer

Apparatus and Method for Forming Alignment Features for Back Side Processing of a Wafer

A method for forming an alignment feature for back side wafer processing in a wafer fabrication process involves forming a trench into but not entirely through a wafer from a top side of the wafer; forming a contrasting material on surfaces of the trench; and grinding a bottom side of the wafer to e...

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Hauptverfasser: TSAU CHRISTINE H, SAWYER WILLIAM DAVID, NUNAN THOMAS KIERAN
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator TSAU CHRISTINE H
SAWYER WILLIAM DAVID
NUNAN THOMAS KIERAN
description A method for forming an alignment feature for back side wafer processing in a wafer fabrication process involves forming a trench into but not entirely through a wafer from a top side of the wafer; forming a contrasting material on surfaces of the trench; and grinding a bottom side of the wafer to expose the trench using the handling wafer to handle the wafer during such grinding, wherein the contrasting material lining the exposed trench provides an alignment reference for precise alignment of the wafer for back side processing the wafer.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Apparatus and Method for Forming Alignment Features for Back Side Processing of a Wafer
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