SEMICONDUCTOR DEVICE WITH CORNER TIE BARS

A Quad Flat Pack (QFP) type semiconductor device includes four corner tie bars that, instead of being trimmed, are used for power and/or ground connections, and alternatively, to control mold flow during the encapsulation step of the assembly process.

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Bibliographische Detailangaben
Hauptverfasser:	CHAN WENG HOONG, KHOO LY HOON, LOW BOON YEW
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A Quad Flat Pack (QFP) type semiconductor device includes four corner tie bars that, instead of being trimmed, are used for power and/or ground connections, and alternatively, to control mold flow during the encapsulation step of the assembly process.