USING AN INTEGRATED CIRCUIT DIE CONFIGURATION FOR PACKAGE HEIGHT REDUCTION

A semiconductor device includes a semiconductor die having a first major surface and a second major surface opposite the first major surface, a first minor surface and a second minor surface opposite the first minor surface, a plurality of contact pads on the first major surface, and a notch which e...

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Bibliographische Detailangaben

Hauptverfasser:	PHAM TIM V, MCSHANE MICHAEL B, GUAJARDO JAMES R
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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