Semiconductor Device and Method of Forming an Interposer Including a Beveled Edge

Semiconductor Device and Method of Forming an Interposer Including a Beveled Edge

A semiconductor device includes a first substrate. The first substrate may be a wafer-level interposer or a die-level interposer. A portion of the first substrate is removed to form a beveled edge. The beveled edge may be formed during singulation of the first substrate. A second substrate is dispos...

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Hauptverfasser: LEE TAE KEUN, LEE KOO HONG
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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LEE KOO HONG
description A semiconductor device includes a first substrate. The first substrate may be a wafer-level interposer or a die-level interposer. A portion of the first substrate is removed to form a beveled edge. The beveled edge may be formed during singulation of the first substrate. A second substrate is disposed over the first substrate. The beveled edge is oriented towards the second substrate. A semiconductor die is disposed over the second substrate. The first and second substrates are disposed within a cavity of a mold. An encapsulant is deposited within the cavity over a first surface of the first substrate between the first and second substrates. The beveled edge reduces encapsulant flow onto a second surface of the first substrate opposite the first surface. The second surface of the first substrate remains free from the encapsulant. The first substrate is singulated before or after the encapsulant is deposited.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor Device and Method of Forming an Interposer Including a Beveled Edge
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